Welcome to Hotenda.com Online Store!

logo
userjoin
Home

TDA18264HB/C1,557

TDA18264HB/C1,557

TDA18264HB/C1,557

NXP USA Inc.

Telecom device16 Circuits

SOT-23

TDA18264HB/C1,557 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 80-TFQFN Exposed Pad
Packaging Tray
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 2.55W
Function Transceiver
Number of Circuits 16
RoHS Status ROHS3 Compliant
TDA18264HB/C1,557 Product Details

TDA18264HB/C1,557 Overview


In order to save space on the board, 80-TFQFN Exposed Pad packages are used.Telecommunications equipment is packed using the Tray method.Mounting type Surface Mount is used.This telecom IC is composed of 16 circuits.

TDA18264HB/C1,557 Features


Available in the 80-TFQFN Exposed Pad package

TDA18264HB/C1,557 Applications


There are a lot of NXP USA Inc. TDA18264HB/C1,557 Telecom applications.

  • Fiber
  • E2 Rates PCM Line Interface
  • E1 Rates PCM Line Interface
  • Central office (CO)
  • Digital Cross-Connect Systems
  • Voice over IP/DSL
  • Intelligent PBX
  • Digital subscriber line access multiplexer (DSLAM)
  • Integrated Multi-Service Access Platforms (IMAPs)
  • CSU/DSU Equipment

Related Part Number

DS21348GN-C01
XRT83VL38ES
XRT83VL38ES
$0 $/piece
SI3245-D-GQ
SI3245-D-GQ
$0 $/piece
ZL50058GAG2
TDA18267HB/C1Y
TDA18267HB/C1Y
$0 $/piece
BCM5704CKFBG
VSC8514XMK-10
LE79231DJCT
MT9172ANR1

Get Subscriber

Enter Your Email Address, Get the Latest News