TWR-MCF5225X

new-10%

TWR-MCF5225X

Manufacturer part number:TWR-MCF5225X

Manufacturer:NXP USA Inc.

Description:MCF5225X, OPEN-SOURCE BDM, USB 2.0, TOWER SYSTEM MODULE; Silicon Manufacturer:NXP; Core Architecture:ColdFire; Core Sub-Architecture:ColdFire v2; Silicon Core Number:MCF52; Silicon Family Name:MCF5225

Case Package:SOT-23

Datasheet:TWR-MCF5225X Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Fixed
Published	2008
Series	ColdFire®
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	MCU 32-Bit
Core Processor	Coldfire V2
Utilized IC / Part	MCF5225x
Contents	Board(s), Cable(s)
Board Type	Evaluation Platform
Platform	Tower System
RoHS Status	ROHS3 Compliant