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XC56L307VF160

XC56L307VF160

XC56L307VF160

NXP USA Inc.

CPLD DSP563xx Series XC56L307 196-LBGA

SOT-23

XC56L307VF160 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-MAPBGA (15x15)
Operating Temperature -40°C~100°C
Packaging Tray
Published 2005
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number XC56L307
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
Voltage - Core 1.80V
On Chip Data RAM 576kB
Clock Rate 160MHz
RoHS Status Non-RoHS Compliant
XC56L307VF160 Product Details

XC56L307VF160 Overview


This is an electronic component with a 196-LBGA package.A packaging way of Tray is provided.As a member of Fixed Point, it is ideally suitable for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.It is important that the device is operated at a temperature of -40°C~100°C in order to ensure its normal functioning.As the name implies, the analog voltage range of 3.30V refers to the voltage that can be inserted or removed.It is a part of the DSP563xx series of digital signal processors.Based on its base part number of XC56L307, many ralated parts can be found.

XC56L307VF160 Features


Supplied in the 196-LBGA package

XC56L307VF160 Applications


There are a lot of NXP USA Inc. XC56L307VF160 DSP applications.

  • Digital hardware
  • Control systems
  • Streaming videos
  • Fourier transform
  • Speech processing
  • Other sensor array processing
  • Speech processing and recognition
  • Radar
  • Sonar
  • Smart phones

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