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XPC850DECZT50BU

XPC850DECZT50BU

XPC850DECZT50BU

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BGA

SOT-23

XPC850DECZT50BU Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
XPC850DECZT50BU Product Details

XPC850DECZT50BU Overview


Due to its 256-BGA packaging, it is convenient to ship overseas. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. From the MPC8xx series. Memory controllers for this CPU are DRAM. Featuring HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces, this microprocessor can better serve you. There is 3.3V I/O running on this CPU. PC850 is a good way to search for variants of the microprocessor.

XPC850DECZT50BU Features




XPC850DECZT50BU Applications


There are a lot of NXP USA Inc.
XPC850DECZT50BU Microprocessor applications.


  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens

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