XPC850DECZT66BU Overview

Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 256-BGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search PC850 for variants of the embedded microprocessor.

XPC850DECZT66BU Features

XPC850DECZT66BU Applications

There are a lot of NXP USA Inc.
XPC850DECZT66BU Microprocessor applications.

• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances
• Home video and audio