Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 256-BGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search PC850 for variants of the embedded microprocessor.
XPC850DEZT66BUR2 Features
XPC850DEZT66BUR2 Applications
There are a lot of NXP USA Inc. XPC850DEZT66BUR2 Microprocessor applications.