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XPC850ZT50BU

XPC850ZT50BU

XPC850ZT50BU

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BGA

SOT-23

XPC850ZT50BU Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
XPC850ZT50BU Product Details

XPC850ZT50BU Overview


With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~95°C TA. A MPC8xx series item. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with PC850.

XPC850ZT50BU Features




XPC850ZT50BU Applications


There are a lot of NXP USA Inc.
XPC850ZT50BU Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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