With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~95°C TA. A MPC8xx series item. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with PC850.
XPC850ZT50BU Features
XPC850ZT50BU Applications
There are a lot of NXP USA Inc. XPC850ZT50BU Microprocessor applications.