OSD3358-512M-ICB

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Manufacturer part number:OSD3358-512M-ICB

Manufacturer:Octavo Systems LLC

Description:OSD3358-512M-ICB datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Octavo Systems LLC stock available on our website

Case Package:SOT-23

Datasheet:OSD3358-512M-ICB Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	8 Weeks
Surface Mount	YES
Operating Temperature	-40°C~85°C
Series	OSD335x
Size / Dimension	1.06 x 1.06 27.0mmx27.0mm
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of Terminations	400
Connector Type	400-BGA
Additional Feature	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	245
Supply Voltage	1.1V
Terminal Pitch	1.27mm
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B400
Speed	1GHz
RAM Size	512MB
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Core Processor	ARM® Cortex®-A8, AM3358
Address Bus Width	16
Boundary Scan	YES
Low Power Mode	YES
External Data Bus Width	8
Format	FIXED POINT
Integrated Cache	YES
Module/Board Type	MPU Core
Flash Size	4GB
Co-Processor	NEON™ SIMD
Height Seated (Max)	2.6mm
Length	27mm
Width	27mm
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$65.50000	$65.5
10	$61.45000	$614.5
100	$55.10020	$5510.02

OSD3358-512M-ICB Description

The OSD3358-512M-ICB C-SiP System-In-Package (SiP) is a self-contained computing system ideal to power the latest embedded applications. It integrates the powerful 1GHz Sitara™ ARM® Cortex®-A8 AM335x Processor from Texas Instruments, up to 1 Gigabyte (GB) of DDR3L memory, up to 16 Gigabytes (GB) of embedded Multimedia Card (eMMC) non-volatile memory, a low power, low jitter MEMs Oscillator, 4 Kilobytes (KB) EEPROM, TPS65217C PMIC, TL5209 LDO, and resistors, capacitors, and inductors into a single 27mm x 27mm easy to use IC package.