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FDMC6675BZ

FDMC6675BZ

FDMC6675BZ

ON Semiconductor

FDMC6675BZ datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDMC6675BZ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 23 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerWDFN
Number of Pins 8
Weight 200mg
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2010
Series PowerTrench®
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 5
ECCN Code EAR99
Resistance 14.4MOhm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature ULTRA-LOW RESISTANCE
Subcategory Other Transistors
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
JESD-30 Code S-PDSO-N5
Number of Elements 1
Power Dissipation-Max 2.3W Ta 36W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.3W
Case Connection DRAIN
Turn On Delay Time 11 ns
FET Type P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 14.4m Ω @ 9.5A, 10V
Vgs(th) (Max) @ Id 3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 2865pF @ 15V
Current - Continuous Drain (Id) @ 25°C 9.5A Ta 20A Tc
Gate Charge (Qg) (Max) @ Vgs 65nC @ 10V
Rise Time 10ns
Drain to Source Voltage (Vdss) 30V
Drive Voltage (Max Rds On,Min Rds On) 4.5V 10V
Vgs (Max) ±25V
Fall Time (Typ) 26 ns
Turn-Off Delay Time 44 ns
Continuous Drain Current (ID) 9.5A
Threshold Voltage -1.9V
Gate to Source Voltage (Vgs) 25V
Drain Current-Max (Abs) (ID) 40A
Drain to Source Breakdown Voltage -30V
Pulsed Drain Current-Max (IDM) 32A
Height 750μm
Length 3.3mm
Width 3.3mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.44660 $1.3398
6,000 $0.42427 $2.54562
15,000 $0.40832 $6.1248
FDMC6675BZ Product Details

FDMC6675BZ Description


The FDMC6675BZ is a P-channel MOSFET produced using the PowerTrench? process. The onsemi FDMC6675BZ is designed to minimize losses in load switch applications. Advancements in both silicon and package technologies have been combined to offer the lowest RDS (ON) and ESD protection. The FDMC6675BZ is suitable for load switch and battery pack applications.



FDMC6675BZ Features


  • Max RDS(on) = 14.4 m at VGS = ?10 V, ID = ?9.5 A

  • Max RDS(on) = 27.0 m at VGS = ?4.5 V, ID = ?6.9 A

  • HBM ESD Protection Level of 8 kV Typical (Note 3)

  • Extended VGSS Range (?25 V) for Battery Applications

  • High Performance Trench Technology for Extremely Low RDS(on)

  • High Power and Current Handling Capability  

  • Pb?Free, Halogen Free/BFR Free and are RoHS Compliant



FDMC6675BZ Applications


  • Load Switch in Notebook 

  • Server

  • Notebook Battery Pack Power Management


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