FDZ5047N Description

The FDZ5047N reduces PCB space and RDS by utilizing Fairchild's 30V PowerTrench technology and cutting-edge BGA packaging (ON). Such BGA Packaging innovation is the MOSFET. the device's technology enables it to combine high current, excellent thermal transfer properties low gate, ultra-low profile packing, and handling capacity low RDS and a charge (ON). These MOSFETs provide quicker switching and less power consumption.

FDZ5047N Features

• Ultra-low gate charge x RDS(ON) product

• Outstanding thermal transfer characteristics

• 22 A, 30 V. RDS(ON) = 2.9 m? @ VGS = 10 V

                   RDS(ON) = 4.5 m? @ VGS = 4.5 V

• Ultra-thin package: less than 0.90 mm in height when mounted to PCB

• Occupies only 27.5 mm2 of PCB area: 1/5 of the area of a TO-220 package

FDZ5047N Applications

• Solenoid drive

• DC/DC converters