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FDZ5047N

FDZ5047N

FDZ5047N

ON Semiconductor

FDZ5047N datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDZ5047N Datasheet

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Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 36-VFBGA
Supplier Device Package 36-BGA (5x5.5)
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2004
Series PowerTrench®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology MOSFET (Metal Oxide)
Power Dissipation-Max 2.8W Ta
FET Type N-Channel
Rds On (Max) @ Id, Vgs 2.9mOhm @ 22A, 10V
Vgs(th) (Max) @ Id 3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 4993pF @ 15V
Current - Continuous Drain (Id) @ 25°C 22A Ta
Gate Charge (Qg) (Max) @ Vgs 73nC @ 5V
Drain to Source Voltage (Vdss) 30V
Drive Voltage (Max Rds On,Min Rds On) 4.5V 10V
Vgs (Max) ±20V
FDZ5047N Product Details

FDZ5047N Description


The FDZ5047N reduces PCB space and RDS by utilizing Fairchild's 30V PowerTrench technology and cutting-edge BGA packaging (ON). Such BGA Packaging innovation is the MOSFET. the device's technology enables it to combine high current, excellent thermal transfer properties low gate, ultra-low profile packing, and handling capacity low RDS and a charge (ON). These MOSFETs provide quicker switching and less power consumption.



FDZ5047N Features


  • Ultra-low gate charge x RDS(ON) product

  • Outstanding thermal transfer characteristics

  • 22 A, 30 V. RDS(ON) = 2.9 m? @ VGS = 10 V

                   RDS(ON) = 4.5 m? @ VGS = 4.5 V

  • Ultra-thin package: less than 0.90 mm in height when mounted to PCB

  • Occupies only 27.5 mm2 of PCB area: 1/5 of the area of a TO-220 package



FDZ5047N Applications


  • Solenoid drive

  • DC/DC converters


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