FNB50560TD1

new-10%

Manufacturer part number:FNB50560TD1

Manufacturer:ON Semiconductor

Description:FNB50560TD1 datasheet pdf and Power Driver Modules product details from ON Semiconductor stock available on our website

Case Package:SOT-23

Datasheet:FNB50560TD1 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Lifecycle Status	ACTIVE (Last Updated: 2 days ago)
Factory Lead Time	13 Weeks
Mount	Through Hole
Mounting Type	Through Hole
Package / Case	20-PowerDIP Module (1.220, 31.00mm)
Weight	5.70216g
Series	Motion SPM® 55
Published	2015
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	20
ECCN Code	EAR99
Type	IGBT
Terminal Finish	Tin (Sn)
Max Operating Temperature	150°C
Min Operating Temperature	-40°C
Additional Feature	ALSO REQUIRED HIGH SIDE BIAS VOLT OF 13V TO 18.5V
HTS Code	8541.29.00.95
Terminal Position	DUAL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Number of Functions	1
Supply Voltage	15V
Reach Compliance Code	not_compliant
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	R-XDMA-T20
Voltage - Isolation	1500Vrms
Supply Voltage-Max (Vsup)	16.5V
Supply Voltage-Min (Vsup)	14V
Configuration	3 Phase Inverter
Max Current Rating	5A
Output Current-Max	10A
Collector Emitter Voltage (VCEO)	2.25V
Min Breakdown Voltage	600V
Length	37mm
Height Seated (Max)	6mm
Width	21mm
RoHS Status	ROHS3 Compliant