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FSBB30CH60DF

FSBB30CH60DF

FSBB30CH60DF

ON Semiconductor

FSBB30CH60DF datasheet pdf and Power Driver Modules product details from ON Semiconductor stock available on our website

SOT-23

FSBB30CH60DF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status ACTIVE, NOT REC (Last Updated: 2 days ago)
Factory Lead Time 14 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 27-PowerDIP Module (1.205, 30.60mm)
Weight 21.978g
Series Motion SPM® 3
Published 2016
JESD-609 Code e3
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
HTS Code 8541.29.00.95
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage - Isolation 2500Vrms
Configuration 3 Phase Inverter
Max Current Rating 30A
Collector Emitter Voltage (VCEO) 2.1V
Min Breakdown Voltage 600V
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $29.61000 $29.61
60 $26.24133 $1574.4798
120 $23.60258 $2832.3096
FSBB30CH60DF Product Details
Description:
The ON Semiconductor FSBB30CH60DF is a Power Driver Module (SPM) designed for use in high-power applications. It is a 600V, 30A SPMPAK module that provides a high-performance, cost-effective solution for driving power MOSFETs and IGBTs. The module features a low-profile, surface-mount package and is designed to provide superior thermal performance and reliability.

Features:
• 600V, 30A SPMPAK module
• Low-profile, surface-mount package
• High-performance, cost-effective solution
• Superior thermal performance and reliability
• Built-in protection features
• Low EMI and ESD susceptibility
• RoHS compliant

Applications:
The ON Semiconductor FSBB30CH60DF Power Driver Module is suitable for a wide range of applications, including motor control, power conversion, and power management. It is ideal for use in high-power applications such as automotive, industrial, and consumer electronics.

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