FSBB30CH60DF datasheet pdf and Power Driver Modules product details from ON Semiconductor stock available on our website
SOT-23
FSBB30CH60DF Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
ACTIVE, NOT REC (Last Updated: 2 days ago)
Factory Lead Time
14 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
27-PowerDIP Module (1.205, 30.60mm)
Weight
21.978g
Series
Motion SPM® 3
Published
2016
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN Code
EAR99
Type
IGBT
Terminal Finish
Tin (Sn)
Max Operating Temperature
150°C
Min Operating Temperature
-40°C
HTS Code
8541.29.00.95
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage - Isolation
2500Vrms
Configuration
3 Phase Inverter
Max Current Rating
30A
Collector Emitter Voltage (VCEO)
2.1V
Min Breakdown Voltage
600V
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$29.61000
$29.61
60
$26.24133
$1574.4798
120
$23.60258
$2832.3096
FSBB30CH60DF Product Details
Description: The ON Semiconductor FSBB30CH60DF is a Power Driver Module (SPM) designed for use in high-power applications. It is a 600V, 30A SPMPAK module that provides a high-performance, cost-effective solution for driving power MOSFETs and IGBTs. The module features a low-profile, surface-mount package and is designed to provide superior thermal performance and reliability.
Features: • 600V, 30A SPMPAK module • Low-profile, surface-mount package • High-performance, cost-effective solution • Superior thermal performance and reliability • Built-in protection features • Low EMI and ESD susceptibility • RoHS compliant
Applications: The ON Semiconductor FSBB30CH60DF Power Driver Module is suitable for a wide range of applications, including motor control, power conversion, and power management. It is ideal for use in high-power applications such as automotive, industrial, and consumer electronics.