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LV5609V-TLM-E

LV5609V-TLM-E

LV5609V-TLM-E

ON Semiconductor

670mW mWApplication Specific Timer2V~5.5V Msps

SOT-23

LV5609V-TLM-E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 2 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 20-LSSOP (0.173, 4.40mm Width)
Number of Pins 20
Operating Temperature -20°C~80°C
Packaging Tape & Reel (TR)
Published 2007
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Power Dissipation 670mW
Voltage - Supply 2V~5.5V
Pin Count 20
Number of Circuits 1
Input CMOS
Ratio - Input:Output 7:5
PLL No
Differential - Input:Output No/No
Main Purpose CCD
RoHS Status ROHS3 Compliant
Lead Free Lead Free
LV5609V-TLM-E Product Details

LV5609V-TLM-E Overview


Clock program is contained in the package Tape & Reel (TR). Clock program is contained in a package of 20-LSSOP (0.173, 4.40mm Width). A mounting type of Surface Mount is recommended. There are 1 on the device. Variations are made in the range of operating temperature -20°C~80°C. The component can provide a voltage of 2V~5.5V. This component primarily serves the purpose of CCD. There are 2007 published parts for this part. Clock program is recommended that Clock program be mounted wClock programh Surface Mount. There are 20 pins on the device. The board has 20 pins.

LV5609V-TLM-E Features


Mounting Type: Surface Mount
Include 1 Circuits
with 20 Pins

LV5609V-TLM-E Applications


There are a lot of ON Semiconductor LV5609V-TLM-E application specific timer?applications.

  • Multi-function Printer
  • MSAN/DSLAM/PON
  • Servers, Storage, Search Acceleration
  • Servers, storage
  • 1 GbE and 10 GbE
  • Telecom line cards
  • Industrial, Embedded Computing
  • Small Cells, Mobile Backhaul/Fronthaul
  • Handheld Instrumentation
  • 10/40/100G network line cards

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