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NCP382HMN10AATXG

NCP382HMN10AATXG

NCP382HMN10AATXG

ON Semiconductor

Tape & Reel (TR) 2 Hot Swap Controllers DFN 2

SOT-23

NCP382HMN10AATXG Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Lifecycle Status LAST SHIPMENTS (Last Updated: 1 week ago)
Mount Surface Mount
Package / Case DFN
Number of Pins 8
Packaging Tape & Reel (TR)
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 110mOhm
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 0.65mm
Pin Count 8
Number of Outputs 2
Operating Supply Voltage 5.5V
Temperature Grade INDUSTRIAL
Number of Channels 2
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Power Dissipation-Max 850mW
Adjustable Threshold NO
Min Input Voltage 2.5V
Max Input Voltage 5.5V
Halogen Free Halogen Free
Length 3mm
Height Seated (Max) 1mm
Width 3mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
NCP382HMN10AATXG Product Details

NCP382HMN10AATXG Overview


As part of the DFN package, it is included.2 channels are currently available.The package looks like a Tape & Reel (TR).8 terminations are present in total.Its terminal position is DUAL.In total, it has 8 pins.High efficiency is possible at a voltage of 5V.A 8 pin is used for operation.The position of the object is in the direction of Surface Mount.For stable operation, 85°C°C is the maximum operating temperature.For reliability, it must work at a minimum temperature of -40°C degrees Celsius.An analog IC, in this case POWER SUPPLY SUPPORT CIRCUIT, is used in this gadget.By default, output 2 is selected.Devices with 110mOhm resistance are available.

NCP382HMN10AATXG Features


The terminal position of 8


NCP382HMN10AATXG Applications


There are a lot of ON Semiconductor
NCP382HMN10AATXG hot swap controllers applications.


  • Networking
  • Telecommunications
  • Industrial
  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure

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