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NDB7060

NDB7060

NDB7060

ON Semiconductor

NDB7060 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

NDB7060 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Operating Temperature -65°C~175°C TJ
Packaging Tape & Reel (TR)
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology MOSFET (Metal Oxide)
Power Dissipation-Max 150W Tc
FET Type N-Channel
Rds On (Max) @ Id, Vgs 13m Ω @ 40A, 10V
Vgs(th) (Max) @ Id 4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 3600pF @ 25V
Current - Continuous Drain (Id) @ 25°C 75A Tc
Gate Charge (Qg) (Max) @ Vgs 115nC @ 10V
Drain to Source Voltage (Vdss) 60V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1.156842 $1.156842
10 $1.091360 $10.9136
100 $1.029585 $102.9585
500 $0.971307 $485.6535
1000 $0.916327 $916.327
NDB7060 Product Details

NDB7060 Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage applications such as automotive, DC/DC converters, PWM motor controls, and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.



NDB7060 Features

75A, 60V. Roscow = 0.0130 @ VGs=10V.

Critical DC electrical parameters specifed at elevated

temperature.

Rugged internal source-drain diode can eliminate the need

for an extemal Zener diode transient suppressor.

175??C maximum junction temperature rating.

High density cell design for extremely low Rosion.

TO-220 and TO-263 (D*PAK) package for both through hole

and surface mount applications.


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