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1708569

1708569

1708569

Phoenix Contact

Pluggable Terminal Blocks 9 Pos 7.62mm pitch Thru Hole Invert Hdr

SOT-23

1708569 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Weight 1.50003kg
PackagingBulk
Published 2012
Series COMBICON IPC
Feature Mating Flange
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Header, Female Sockets
Number of Positions 9
Color Green
Number of Rows 1
Voltage - Rated 630V
Pitch 0.300 7.62mm
Orientation Right Angle
Depth 30.1mm
Insulation Height 0.504 12.80mm
Current Rating41A
Termination Style Solder
Voltage 600V
Contact Tail Length 0.197 5.00mm
Max Current Rating 41A
Number of Levels 1
Current 5A
Number of Decks 1
Voltage - IEC 1kV
Number of Ways 9
Safety Approval UL
Header Orientation 90°, Right Angle
Number of Positions Per Level 9
Length 76.18mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:357 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$19.02460$951.23

About 1708569

The 1708569 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 9 Pos 7.62mm pitch Thru Hole Invert Hdr.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1708569, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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