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1782556

1782556

1782556

Phoenix Contact

Pluggable Terminal Blocks 11 Pos 3.81mm pitch Through Hole Header

SOT-23

1782556 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP)
PackagingTape & Reel (TR)
Published 2014
Series COMBICON MC
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 11
Color Black
Number of Rows 1
Voltage - Rated 160V
Additional FeatureLCP, UL 94V-0, LOW PROFILE
HTS Code8536.69.40.40
Pitch 0.150 3.81mm
Insulation Height 0.272 6.91mm
Current Rating8A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.102 2.60mm
Number of Levels 1
Current 8A
Contact Mating Finish Tin
Number of Decks 1
Voltage - IEC 250V
Number of Ways 11
Safety Approval CUL; GOST; UL
Header Orientation 90°, Right Angle
Fastening Method CONNECTOR
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:1301 items

Pricing & Ordering

QuantityUnit PriceExt. Price
470$5.25800$2471.26

About 1782556

The 1782556 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 11 Pos 3.81mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1782556, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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