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1789180

1789180

1789180

Phoenix Contact

Phoenix Contact MC Series, 3.5mm Pitch 3 Way Printed Circuit Board Connector, Solder Termination, 8A

SOT-23

1789180 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP)
PackagingBulk
Published 2015
Series COMBICON MC
Feature Mating and Mounting Flange
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Header, Male Pins, Shrouded (4 Side)
Color Black
Voltage - Rated 250V
Pitch 0.138 3.50mm
Insulation Height 0.272 6.91mm
Current Rating8A
Termination Style Solder
Voltage 300V
Contact Tail Length 0.102 2.60mm
Number of Levels 1
Current 8A
Contact Mating Finish Tin
Voltage - UL 300V
Header Orientation 90°, Right Angle
Number of Positions Per Level 3
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:1856 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.754921$3.754921
10$3.542379$35.42379
100$3.341866$334.1866
500$3.152704$1576.352
1000$2.974250$2974.25

About 1789180

The 1789180 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Phoenix Contact MC Series, 3.5mm Pitch 3 Way Printed Circuit Board Connector, Solder Termination, 8A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1789180, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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