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1952733

  • 1952733
  • 1952733

1952733

1952733

Phoenix Contact

1952733 datasheet pdf and Terminal Blocks - Headers, Plugs and Sockets product details from Phoenix Contact stock available on our website

SOT-23

1952733 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP)
Weight 105g
Packaging Bulk
Published 2002
Series COMBICON MCDNV
Feature Locking Ramp
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 32
Color Black
Number of Rows 1
Voltage - Rated 160V
Additional Feature LCP, UL 94V-0
HTS Code 8536.69.40.40
Pitch 0.138 3.50mm
Insulation Height 0.524 13.30mm
Current Rating 8A
Termination Style Solder
Voltage 150V
Contact Tail Length 0.102 2.60mm
Number of Levels 2
Current 8A
Contact Mating Finish Tin
Voltage - UL 150V
Number of Decks 1
Voltage - IEC 250V
Number of Ways 16
Safety Approval UL
Header Orientation Vertical
Current - IEC 8A per Position
Number of Positions Per Level 16
Fastening Method CONNECTOR
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $17.634557 $17.634557
10 $16.636374 $166.36374
100 $15.694693 $1569.4693
500 $14.806314 $7403.157
1000 $13.968221 $13968.221
1952733 Product Details

1952733 Overview


Through Hole is the mounting type.Packaged in a Bulk case.A member of the COMBICON MCDNV Series.In addition, there are other features such as LCP, UL 94V-0, to mention only a few.It is more powerful in many ways due to its Locking Ramp feature.Through Hole mounts the part.It shares many benefts with other Header, Male Pins, Shrouded (4 Side) products.

1952733 Features


COMBICON MCDNV series

1952733 Applications


There are a lot of Phoenix Contact 1952733 Terminal Blocks applications.

  • Refrigeration control
  • Telecommunications
  • Variable speed/frequency drivers
  • Communication
  • Embedded systems
  • Data Technology
  • Transportation
  • Medical technology
  • Anywhere power is distributed
  • Instrumentation

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