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1961229

1961229

1961229

Phoenix Contact

Pluggable Terminal Blocks 10 Pos 2.5mm pitch Through Hole Header

SOT-23

1961229 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Weight 8.620013g
PackagingBulk
Published 2002
Series MICRO-COMBICON MCD
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 20
Color Black
Number of Rows 1
Voltage - Rated 80V
Additional FeaturePA, 94V-0
HTS Code8536.69.40.40
Pitch 0.098 2.50mm
Insulation Height 0.862 21.89mm
Current Rating4A
Termination Style Solder
Contact Tail Length 0.150 3.81mm
Number of Levels 2
Contact Mating Finish Tin
Number of Decks 1
Voltage - IEC 160V
Positions Per Level 10
Number of Ways 10
Safety Approval UL
Header Orientation 90°, Right Angle
Fastening Method CONNECTOR
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:405 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$18.71100$935.55

About 1961229

The 1961229 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 10 Pos 2.5mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1961229, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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