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1963670

1963670

1963670

Phoenix Contact

Pluggable Terminal Blocks 5 Pos 2.5mm pitch Through Hole Header

SOT-23

1963670 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Weight 77.999999g
PackagingTape & Reel (TR)
Published 2010
Series MICRO-COMBICON MC
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Color Black
Number of Rows 1
Voltage - Rated 32V
Additional FeaturePA, UL 94V-0
Pitch 0.098 2.50mm
Insulation Height 0.319 8.10mm
Current Rating4A
Termination Style Solder
Voltage 125V
Contact Tail Length 0.150 3.81mm
Number of Levels 1
Current 4A
Contact Mating Finish Tin
Voltage - UL 125V
Number of Decks 1
Voltage - IEC 160V
Number of Ways 5
Safety Approval UL
Header Orientation 90°, Right Angle
Number of Positions Per Level 5
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:1864 items

Pricing & Ordering

QuantityUnit PriceExt. Price
330$3.22300$1063.59

About 1963670

The 1963670 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 5 Pos 2.5mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1963670, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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