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1963803

1963803

1963803

Phoenix Contact

Pluggable Terminal Blocks 7 Pos 2.5mm pitch Through Hole Header

SOT-23

1963803 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Weight 79g
PackagingTape & Reel (TR)
Published 2003
Series MICRO-COMBICON MC
Feature Pick and Place Cap
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Header, Male Pins, Shrouded (4 Side)
Number of Positions 7
Color Black
Number of Rows 1
Voltage - Rated 32V
Additional FeaturePA, 94V-0
HTS Code8536.69.40.40
Pitch 0.098 2.50mm
Insulation Height 0.398 10.11mm
Current Rating4A
Termination Style Solder
Voltage 125V
Contact Tail Length 0.138 3.50mm
Number of Levels 1
Current 4A
Contact Mating Finish Tin
Number of Decks 1
Voltage - IEC 160V
Number of Ways 7
Safety Approval UL
Header Orientation Vertical
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:1865 items

Pricing & Ordering

QuantityUnit PriceExt. Price
220$3.89400$856.68

About 1963803

The 1963803 from Phoenix Contact is a high-performance microcontroller designed for a wide range of embedded applications. This component features Pluggable Terminal Blocks 7 Pos 2.5mm pitch Through Hole Header.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1963803, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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