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317-87-118-41-026101

317-87-118-41-026101

317-87-118-41-026101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled18 PositionsFemale Socket

SOT-23

317-87-118-41-026101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 317
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 18
Number of Rows 1
Fastening Type Push-Pull
Subcategory Headers and Edge Type Connectors
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 1A
Insulation Height 0.394 10.00mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.070 1.78mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Contact Length - Post 0.157 4.00mm
Number Of PCB Rows 1
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.098 inch
Body Depth 0.394 inch
Mating Contact Pitch 0.07 inch
Polarization Key POLARIZED HOUSING
Durability 500 Cycles
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
270 $1.78122 $480.9294
317-87-118-41-026101 Product Details

317-87-118-41-026101 Overview


The packaging contains Socket.There is a mounting type of Through Hole for this device.Packaging for the product is carried out via a Bulk case.317 Series product.By Through Hole it's mounted.Running in -55°C~125°C Operating Temperature.

317-87-118-41-026101 Features


317 series

317-87-118-41-026101 Applications


There are a lot of Preci-Dip 317-87-118-41-026101 Rectangular Connectors applications.

  • Communication
  • Telecommunications
  • Transportation
  • Military Technology
  • Automotive Electronics
  • Data Technology
  • Industrial Automation
  • Instrumentation
  • Datacom
  • Embedded systems

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