550-10-352M26-001166

new-10%

Manufacturer part number:550-10-352M26-001166

Manufacturer:Preci-Dip

Description:550-10-352M26-001166 datasheet pdf and Sockets for ICs, Transistors product details from Preci-Dip stock available on our website

Case Package:SOT-23

Datasheet:550-10-352M26-001166 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Mounting Type	Through Hole
Housing Material	FR4 Epoxy Glass
Number of Positions or Pins (Grid)	352 (26 x 26)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Operating Temperature	-55°C~125°C
Packaging	Bulk
Series	550
Published	2012
Feature	Closed Frame
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Type	BGA
Contact Finish - Mating	Gold
Current Rating (Amps)	1A
Pitch - Mating	0.050 1.27mm
Contact Resistance	10mOhm
Termination Post Length	0.098 2.50mm
Pitch - Post	0.050 1.27mm
Contact Finish Thickness - Mating	10.0μin 0.25μm
Contact Finish Thickness - Post	10.0μin 0.25μm
Material Flammability Rating	UL94 V-0
RoHS Status	ROHS3 Compliant