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801-83-015-10-268101

801-83-015-10-268101

801-83-015-10-268101

Preci-Dip

1 Rows Socket Solder Beryllium Copper Through Hole Bulk Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 15 Positions Female Socket

SOT-23

801-83-015-10-268101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 801
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 15
Number of Rows 1
Fastening Type Push-Pull
Subcategory Headers and Edge Type Connectors
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Terminal Pitch 2.54mm
Insulation Height 0.116 2.95mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Contact Length - Post 0.108 2.75mm
Number Of PCB Rows 1
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Polarization Key POLARIZED HOUSING
Durability 500 Cycles
Plating Thickness 30μin
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
290 $1.71252 $496.6308
801-83-015-10-268101 Product Details

801-83-015-10-268101 Overview


This product is packaged in a Socket box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the 801 Series.By Through Hole, the part is mounted.Operating temperature is set to -55°C~125°C.

801-83-015-10-268101 Features


801 series


801-83-015-10-268101 Applications


There are a lot of Preci-Dip
801-83-015-10-268101 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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