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801-87-006-40-001191

  • 801-87-006-40-001191
  • 801-87-006-40-001191

801-87-006-40-001191

801-87-006-40-001191

Preci-Dip

1 RowsSocketSolderBeryllium CopperSurface Mount, Right AngleTubeGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled6 PositionsFemale Socket

SOT-23

801-87-006-40-001191 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Contact Plating Gold, Tin
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Housing Material Glass fibre
Operating Temperature -55°C~125°C
Packaging Tube
Published 2010
Series 801
Feature Pick and Place
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 6
Number of Rows 1
Voltage - Rated 150V
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Orientation Right Angle
Depth 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Finish - Post Tin
Length 15.24mm
Width 7mm
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,300 $0.62539 $0.62539
801-87-006-40-001191 Product Details

801-87-006-40-001191 Overview


Currently, it is packaged in Socket.It's mounted Surface Mount, Right Angle.We package the product with a Tube case.Specifically, it is one of the products in the 801 Series.A number of advantages can be derived from its Pick and Place feature.There's a Surface Mount on the part.In this case, the device operates at -55°C~125°C Operating Temperature.

801-87-006-40-001191 Features


801 series

801-87-006-40-001191 Applications


There are a lot of Preci-Dip 801-87-006-40-001191 Rectangular Connectors applications.

  • Embedded systems
  • Military Technology
  • Medical technology
  • Transportation
  • Telecommunications
  • Communication
  • Data Technology
  • Instrumentation
  • Industrial Automation
  • Datacom

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