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803-87-018-30-001191

  • 803-87-018-30-001191
  • 803-87-018-30-001191

803-87-018-30-001191

803-87-018-30-001191

Preci-Dip

2 RowsSocketSolderBeryllium CopperSurface MountTubeGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled18 PositionsFemale Socket

SOT-23

803-87-018-30-001191 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Surface Mount
Mounting Type Surface Mount
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Tube
Published 2012
Series 803
Feature Pick and Place
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 18
Number of Rows 2
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Insulation Height 0.339 8.61mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
350 $1.81346 $634.711
803-87-018-30-001191 Product Details

803-87-018-30-001191 Overview


The packaging is Socket.The mounting type of the device is Surface Mount.We package the product with a Tube case.A member of the 803 Series.In many ways, Pick and Place makes it more powerful.The part is mounted by Surface Mount.This device operates at a temperature of -55°C~125°C.

803-87-018-30-001191 Features


803 series

803-87-018-30-001191 Applications


There are a lot of Preci-Dip 803-87-018-30-001191 Rectangular Connectors applications.

  • Data Technology
  • Communication
  • Datacom
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Military Technology
  • Transportation
  • Telecommunications
  • Embedded systems

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