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831-83-010-64-001101

831-83-010-64-001101

831-83-010-64-001101

Preci-Dip

1 RowsSocketPress-Fit, SolderBeryllium CopperThrough HoleBulkGoldLiquid Crystal Polymer (LCP), Glass Filled10 PositionsFemale Socket

SOT-23

831-83-010-64-001101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 831
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Solder
ECCN Code EAR99
Connector Type Socket
Number of Positions 10
Number of Rows 1
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Insulation Height 0.165 4.20mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Contact Length - Post 0.098 2.50mm
Number of Contacts 10
Contact Finish - Post Tin
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
290 $1.70428 $494.2412
831-83-010-64-001101 Product Details

831-83-010-64-001101 Overview


The product comes in a package of Socket.Through Hole is the mounting type for the device.Bulk cases are used to package the product.Among the products in the 831 Series, it is one of the most popular.There are also other features, like STANDARD: UL 94V-0, to name a few.There is a mounting hole at Through Hole.In this case, the device operates at -55°C~125°C Operating Temperature.

831-83-010-64-001101 Features


831 series

831-83-010-64-001101 Applications


There are a lot of Preci-Dip 831-83-010-64-001101 Rectangular Connectors applications.

  • Industrial Automation
  • Telecommunications
  • Automotive Electronics
  • Data Technology
  • Embedded systems
  • Instrumentation
  • Communication
  • Medical technology
  • Military Technology
  • Transportation

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