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861-83-023-10-001101

861-83-023-10-001101

861-83-023-10-001101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled23 PositionsFemale Socket

SOT-23

861-83-023-10-001101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 861
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 23
Number of Rows 1
Additional Feature LOW PROFILE
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 1A
Insulation Height 0.098 2.50mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.039 1.00mm
Insulation Color Black
Contact Length - Post 0.098 2.50mm
Contact Finish - Post Tin
UL Flammability Code 94V-0
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
140 $3.78107 $529.3498
861-83-023-10-001101 Product Details

861-83-023-10-001101 Overview


This product is packaged in a Socket box.The device's mounting type is Through Hole.The product is packaged in a Bulk case.The product is a part of the 861 Series.Additionally, there are features like LOW PROFILE, just to name a few.Mounting of the part is based on Through Hole.The device is operating at -55°C~125°C Operating Temperature.

861-83-023-10-001101 Features


861 series

861-83-023-10-001101 Applications


There are a lot of Preci-Dip 861-83-023-10-001101 Rectangular Connectors applications.

  • Data Technology
  • Embedded systems
  • Datacom
  • Transportation
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Telecommunications
  • Communication
  • Instrumentation

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