128KB 128K x 8 FLASH V850ES 32-Bit Microcontroller V850ES/Fx3 Series 80-LQFP
SOT-23
UPD70F3372M1GKA-GAK-AX Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
80-LQFP
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
V850ES/Fx3
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Pin Count
80
Oscillator Type
Internal
Number of I/O
67
Speed
32MHz
RAM Size
8K x 8
Voltage - Supply (Vcc/Vdd)
3.3V~5.5V
Core Processor
V850ES
Peripherals
DMA, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
128KB 128K x 8
Connectivity
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Data Converter
A/D 12x10b
RoHS Status
ROHS3 Compliant
UPD70F3372M1GKA-GAK-AX Product Details
UPD70F3372M1GKA-GAK-AX Overview
The package is 80-LQFP-shaped. There are 67 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the V850ES/Fx3 series of electrical components. Having a size of 128KB 128K x 8, Microcontroller has a program memory of X bytes. A V850ES Core Processor is at the core of this Microcontroller. The pin count is 80.
UPD70F3372M1GKA-GAK-AX Features
80-LQFP package Mounting type of Surface Mount
UPD70F3372M1GKA-GAK-AX Applications
There are a lot of Renesas Electronics America UPD70F3372M1GKA-GAK-AX Microcontroller applications.