2GB 2G x 8 FLASH V850E2M 32-Bit Microcontroller V850E2/Dx4-H Series 176-LQFP Exposed Pad
SOT-23
UPD70F3529GMA9-GBK-Q-G Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
20 Weeks
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
V850E2/Dx4-H
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Number of I/O
127
Speed
80MHz
RAM Size
96K x 8
Voltage - Supply (Vcc/Vdd)
2.7V~5.5V
Core Processor
V850E2M
Peripherals
DMA, I2S, LCD, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
2GB 2G x 8
Connectivity
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Data Converter
A/D 12x10b, 12x12b
EEPROM Size
32K x 8
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$19.71000
$19.71
10
$17.92000
$179.2
40
$16.57600
$663.04
120
$15.23200
$1827.84
280
$13.88800
$3888.64
520
$12.99200
$6755.84
1,000
$11.91680
$11.9168
UPD70F3529GMA9-GBK-Q-G Product Details
UPD70F3529GMA9-GBK-Q-G Overview
Packaged in a 176-LQFP Exposed Pad format, this MCU is available in a compact size. There are 127 I/Os on the Microcontroller. It is important to note that the Microcontroller has a Surface Mount mounting type. 32-Bit core is the basis for this Microcontroller. This program has a type of memory called FLASH for this MCU's program memory. Temperatures in this range are operated by this Microcontroller. The V850E2/Dx4-H series includes this electrical component. There is 2GB 2G x 8 bytes of program memory in MCU, which corresponds to the size of the program. With a V850E2M Core processor, MCU is equipped with the latest technology available.
UPD70F3529GMA9-GBK-Q-G Features
176-LQFP Exposed Pad package Mounting type of Surface Mount
UPD70F3529GMA9-GBK-Q-G Applications
There are a lot of Renesas Electronics America UPD70F3529GMA9-GBK-Q-G Microcontroller applications.