128KB 128K x 8 FLASH V850ES 32-Bit Microcontroller V850ES/Jx3-L Series UPD70F3808 64 Pin 20MHz 64-LQFP
SOT-23
UPD70F3808GB(R)-GAH-AX Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
24 Weeks
Mounting Type
Surface Mount
Package / Case
64-LQFP
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
V850ES/Jx3-L
Published
2011
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Frequency
20MHz
Base Part Number
UPD70F3808
Interface
EBI/EMI, I2C, UART, USART
Memory Size
128kB
Oscillator Type
Internal
Number of I/O
50
RAM Size
8K x 8
Voltage - Supply (Vcc/Vdd)
2.2V~3.6V
Core Processor
V850ES
Peripherals
DMA, LVD, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
128KB 128K x 8
Connectivity
CSI, EBI/EMI, I2C, UART/USART
Data Converter
A/D 10x10b; D/A 1x8b
RoHS Status
ROHS3 Compliant
UPD70F3808GB(R)-GAH-AX Product Details
UPD70F3808GB(R)-GAH-AX Overview
There is a 64-LQFP package available. The board has 50 I/Os. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. A 32-Bit core is used in order to power the IC chip. The type of memory it uses for its program is FLASH. -40°C~85°C TA is the temperature range at which this Microcontroller operates. V850ES/Jx3-L-series components are electrical components. In the case of this Microcontroller, the memory size of the program is 128KB 128K x 8. Powered by a V850ES Core processor. This IC part has a memory size of 128kB. There are a number of alternatives to the base part number UPD70F3808 that you can find. Performing well when operated at frequency 20MHz can be achieved. On the chip, there are 64 pins that can be accessed.
UPD70F3808GB(R)-GAH-AX Features
64-LQFP package Mounting type of Surface Mount
UPD70F3808GB(R)-GAH-AX Applications
There are a lot of Renesas Electronics America UPD70F3808GB(R)-GAH-AX Microcontroller applications.