72T18115L5BBGI Overview

The 240-BGA package contains FIFO memory chip.In this case, it is packaged in case number Tray .There is a 4.5M 256K x 18 512K x 9 MB memory on the FIFO chips, which can be used to store both applications and data.A temperature regulation of -40°C~85°C is crucial for reliable operation.It is mounted in the Surface Mount position.For operation, a voltage of 2.375V~2.625V is used.The 72T series is represented by this memory logic.A maximum operating supply current of 70mA is provided by this FIFO products.A member of the 72T18115 family, it has the following characteristics.

72T18115L5BBGI Features

4.5M 256K x 18 512K x 9 memory size
72T series
Best part number of 72T18115

72T18115L5BBGI Applications

There are a lot of Renesas Electronics America Inc. 72T18115L5BBGI FIFOs Memory applications.

• Application that requires re-writable nonvolatile parameter memory
• Game Consoles
• SPD for DDR3 Memory Modules
• Product traceability
• Switches
• Notebook
• Computer Systems
• Address mapping
• SPI Bus Flash Memory Device
• High-speed graphics pixel buffer