74SSTU32866BBFG Overview

As a packaging method, Tray is used.The 96-LFBGA package contains it.To ensure normal operation of the device, 1.7V~1.9V is supplied.A Surface Mount mounting method is used for mounting electronic parts.The operating temperature is set to 0°C~70°C.Information is stored in the memory with a size of 25, 14 bits.Based on its base part number 74SSTU32866, related parts can be found.

74SSTU32866BBFG Features

74SSTU32866BBFG Applications

There are a lot of Renesas Electronics America Inc.
74SSTU32866BBFG Specialty Logic ICs applications.

• Cell phones
• Wireless modems
• Remote controls
• Wireless network systems
• Satellite communications networks
• Ethernet circuitry
• Wired telephone
• Cordless telephone
• Desktop PC
• Notebook