82P2521BH Overview

Board space can be saved by using the 640-BGA Exposed Pad package.To pack telecommunications equipment, the way of Tray is used.A Surface Mount mounting type is used.When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.IDT82P2521 is the base part number, which can be used to find more related parts.

82P2521BH Features

Available in the 640-BGA Exposed Pad package

82P2521BH Applications

There are a lot of Renesas Electronics America Inc. 82P2521BH Telecom applications.

• Digital Cross Connect Systems
• Inverse Multiplexing for ATM (IMA) Wireless Base Stations
• Interfaces to SONET STS-1 Networks
• Fiber in the loop (FITL)
• T3 channelized access concentrators
• E1 Network Equipment
• E1 Multiplexer
• PBX interfaces
• Voice over packet gateways
• High-Density T1/E1/J1 interfaces for Multiplexers