82P2821BHG Overview

Saving board space is achieved with the 640-BGA Exposed Pad package.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .The voltage supplied to 1.8V 3.3V can improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.IDT82P2821 is the base part number, which can be used to find more related parts.

82P2821BHG Features

Available in the 640-BGA Exposed Pad package

82P2821BHG Applications

There are a lot of Renesas Electronics America Inc. 82P2821BHG Telecom applications.

• Central office
• Digital Cross-Connect Systems
• Fiber Optic Terminals
• CSU/DSU E1 Interface
• Integrated Multi-Service Access Platforms (IMAPs)
• Cable Modem
• ISDN Primary Rate Interface
• High-Density T1/E1/J1 interfaces for Multiplexers
• Channel Banks
• NIU