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8T33FS6111DXGI

8T33FS6111DXGI

8T33FS6111DXGI

Renesas Electronics America Inc.

1 Circuit 2.7GHz 1:10 Clock Buffer 32-TQFP Exposed Pad

SOT-23

8T33FS6111DXGI Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 32-TQFP Exposed Pad
Operating Temperature -40°C~85°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fanout Buffer (Distribution)
Voltage - Supply 2.5V 3.3V
Output LVPECL
Number of Circuits 1
Frequency (Max) 2.7GHz
Input HSTL, LVPECL
Ratio - Input:Output 1:10
Differential - Input:Output Yes/Yes
RoHS Status ROHS3 Compliant
8T33FS6111DXGI Product Details

8T33FS6111DXGI Overview


The clock divider is packaged in a 32-TQFP Exposed Pad case. It's?packaged?in?the?form?of?a Tray. For normal operation, 2.7GHz is the maximum value. It's?set?up?in?the?way?of?Surface Mount. Electronic components classified as Fanout Buffer (Distribution) fall into this category. Temperature -40°C~85°C TA is recommended for reliable performance. 2.5V 3.3V V power should work with it. There is LVPECL output from clock driver.

8T33FS6111DXGI Features


The operating temperature of -40°C~85°C TA degrees

8T33FS6111DXGI Applications


There are a lot of Renesas Electronics America Inc. 8T33FS6111DXGI Clock Buffers & Drivers applications.

  • Clock signal level shifting
  • DDR4 JEDEC standard RDIMM design
  • Defense and aerospace equipment
  • Global positioning system (GPS)
  • Tlecom applications
  • Other PCIe Gen2 networking applications
  • Network
  • High-performance workstation
  • Tower server
  • DDR4 JEDEC standard LRDIMM design

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