HI5731BIB-T Overview

There are two packages that contain it: 28-SOIC (0.295, 7.50mm Width) package and X package. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -40°C~85°C range. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. In order to find related parts, use the part number HI5731 as a base.

HI5731BIB-T Features

28-SOIC (0.295, 7.50mm Width) package

HI5731BIB-T Applications

There are a lot of Renesas Electronics America Inc.
HI5731BIB-T Digital to Analog Converters (DAC) applications.

• Digital Potentiometer
• Software Radio
• Wireless infrastructure:
• WCDMA, CDMA2000, TD-SCDMA, WiMAX
• Wideband communications:
• LMDS/MMDS, point-to-point
• Instrumentation:
• RF signal generators, arbitrary waveform generators
• Mobile Communications
• Process Control and Industrial Automation