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HI5741BIBZ

HI5741BIBZ

HI5741BIBZ

Renesas Electronics America Inc.

DAC Current - Unbuffered Surface Mount Current Source, R-2R R

SOT-23

HI5741BIBZ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295, 7.50mm Width)
Operating Temperature -40°C~85°C
Packaging Tube
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Matte Tin (Sn)
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number HI5741
Pin Count 28
Output Type Current - Unbuffered
Number of Bits 14
Architecture Current Source, R-2R
Converter Type D/A CONVERTER
Reference Type External, Internal
Data Interface Parallel
Differential Output Yes
Voltage - Supply, Analog 5V
Voltage - Supply, Digital ±5V
Settling Time 20ns (Typ)
INL/DNL (LSB) ±1, ±0.5
Number of D/A Converters 1
RoHS Status ROHS3 Compliant
HI5741BIBZ Product Details

HI5741BIBZ Overview


This package is included in the 28-SOIC (0.295, 7.50mm Width) package and is available for purchase. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~85°C at all times. Using the Tube layout, this FPGA model can be contained in a very small amount of space. Parts related to this part can be found using its base part number HI5741. The device has a total of 28 pins on it.

HI5741BIBZ Features


28-SOIC (0.295, 7.50mm Width) package
28 pin count


HI5741BIBZ Applications


There are a lot of Renesas Electronics America Inc.
HI5741BIBZ Digital to Analog Converters (DAC) applications.


  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators

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