HI5741BIBZ-T Overview

A 28-SOIC (0.295, 7.50mm Width) package contains it, and it is available for download. An FPGA module can be attached to a development board with a Surface Mount-pin. It is necessary to keep the operating temperature within -40°C~85°C when the device is operating. It is for space saving reasons that this FPGA model is contained in Cut Tape (CT). In order to find related parts, you can use its base part number HI5741.

HI5741BIBZ-T Features

28-SOIC (0.295, 7.50mm Width) package

HI5741BIBZ-T Applications

There are a lot of Renesas Electronics America Inc. HI5741BIBZ-T Digital to Analog Converters (DAC)?applications.

• RF signal generators, arbitrary waveform generators
• DAT Recorders and Players
• Audio Amplifier
• Closed-loop process control
• Instrumentation
• Automatic Test Equipment
• Industrial Control Systems
• Digital Offset & Gain Adjustment
• General Purpose Trimming Adjustments
• Data Distribution System