HI5760BIB-T Overview

In the package 28-SOIC (0.295, 7.50mm Width), this product is provided. By attaching the Surface Mount connector, you can use this FPGA module with your development board. It is necessary to keep the operating temperature within -40°C~85°C when the device is operating. As a result of space limitations, this FPGA model has been included in Tape & Reel (TR). HI5760 is the base part number that can be used to identify related parts.

HI5760BIB-T Features

28-SOIC (0.295, 7.50mm Width) package

HI5760BIB-T Applications

There are a lot of Renesas Electronics America Inc.
HI5760BIB-T Digital to Analog Converters (DAC) applications.

• Wireless infrastructure:
• WCDMA, CDMA2000, TD-SCDMA, WiMAX
• Wideband communications:
• LMDS/MMDS, point-to-point
• Instrumentation:
• RF signal generators, arbitrary waveform generators
• Mobile Communications
• Process Control and Industrial Automation
• Automatic Test Equipment
• Portable Equipment