HI5860IA-T Overview

There is a 28-TSSOP (0.173, 4.40mm Width) package that includes this component. The Surface Mount-slot on the development board allows you to attach the FPGA module. While operating, the operating temperature should be kept within a range of -40°C~85°C. As a space-saving measure, this FPGA model is contained within Tape & Reel (TR). In order to find related parts, you can use its base part number HI5860.

HI5860IA-T Features

28-TSSOP (0.173, 4.40mm Width) package

HI5860IA-T Applications

There are a lot of Renesas Electronics America Inc.
HI5860IA-T Digital to Analog Converters (DAC) applications.

• Display Electronics
• Data Acquisition Systems
• Calibration
• Motor Control
• Data Distribution System
• Digital Potentiometer
• Software Radio
• Wireless infrastructure:
• WCDMA, CDMA2000, TD-SCDMA, WiMAX
• Wideband communications: