HSP50214BVCZ datasheet pdf and RF Misc ICs and Modules product details from Renesas Electronics America Inc. stock available on our website
SOT-23
HSP50214BVCZ Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
120-BQFP
Packaging
Tray
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Function
Downconverter
Telecom IC Type
TELECOM CIRCUIT
RF Type
AMPS, CDMA, GSM, TDMA
RoHS Status
ROHS3 Compliant
HSP50214BVCZ Product Details
HSP50214BVCZ Overview
The enhanced 120-BQFP package makes it an excellent RF IC.The package of this RF modulator is Tray.On any Surface Mount-type PCB or development board, this RF modulator can be placed.
HSP50214BVCZ Features
120-BQFP package Tray
HSP50214BVCZ Applications
There are a lot of Renesas Electronics America Inc. HSP50214BVCZ RF Misc ICs and Modules applications.