HSP50216KIZ datasheet pdf and RF Misc ICs and Modules product details from Renesas Electronics America Inc. stock available on our website
SOT-23
HSP50216KIZ Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
196-LFBGA
Surface Mount
YES
Packaging
Tray
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
196
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.8mm
[email protected] Reflow Temperature-Max (s)
40
JESD-30 Code
S-PBGA-B196
Function
Downconverter
Qualification Status
Not Qualified
Operating Temperature (Max)
85°C
Operating Temperature (Min)
-40°C
Temperature Grade
INDUSTRIAL
Telecom IC Type
BASEBAND CIRCUIT
RF Type
W-CDMA
Height Seated (Max)
1.5mm
Length
12mm
Width
12mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
24
$99.72500
$2393.4
HSP50216KIZ Product Details
HSP50216KIZ Overview
An excellent RF IC thanks to its enhanced 196-LFBGA package.In the Tray package, this RF modulator is mounted.This RF modulator can be placed on any Surface Mount-type PCB or development board.Integrated into this RF module are 196 terminations that are used for driving and receiving signals from data.
HSP50216KIZ Features
196-LFBGA package Tray 196 terminations
HSP50216KIZ Applications
There are a lot of Renesas Electronics America Inc. HSP50216KIZ RF Misc ICs and Modules applications.