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IDT2309B-1DC8

IDT2309B-1DC8

IDT2309B-1DC8

Renesas Electronics America Inc.

Zero Delay Buffer 133MHz IDT2309-1 Clock Generators 16-SOIC (0.154, 3.90mm Width) Surface Mount 3V~3.6V Tape & Reel (TR)

SOT-23

IDT2309B-1DC8 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154, 3.90mm Width)
Supplier Device Package 16-SOIC
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Zero Delay Buffer
Voltage - Supply 3V~3.6V
Base Part Number IDT2309-1
Output LVTTL
Number of Circuits 1
Frequency (Max) 133MHz
Input LVTTL
Ratio - Input:Output 1:9
PLL Yes with Bypass
Differential - Input:Output No/No
Divider/Multiplier No/No
RoHS Status Non-RoHS Compliant
IDT2309B-1DC8 Product Details

IDT2309B-1DC8 Overview


Clock ICs are packaged using the Tape & Reel (TR) method. Clock PLL is embedded in the 16-SOIC (0.154, 3.90mm Width) package. This Clock PLL will be fed by LVTTL as its input. 1 circuits are used to achieve clock PLL's superior flexibility. 133MHz is the maximal value for normal operation. The Surface Mount allows the electrical component to be installed conveniently on the panel. There are 3V~3.6V available for use with this clock PLL. The ambient temperature should be set at 0°C~70°C, which is estimated by the test statistics. LVTTL logic levels are supported by this RF synthesizer. As far as electrical parts go, this component can be classified as a Zero Delay Buffer component. You can find related electrical components to the base part number IDT2309-1.

IDT2309B-1DC8 Features


Available in the 16-SOIC (0.154, 3.90mm Width)

IDT2309B-1DC8 Applications


There are a lot of Renesas Electronics America Inc. IDT2309B-1DC8 Clock Generators applications.

  • High-speed communication applications
  • 10 Gigabit Ethernet
  • Multi-function printers
  • Wireless base station for LTE, LTE-advanced
  • Ultrasound diagnosis
  • Wide area power system
  • Mobile telephones
  • Communication infrastructure
  • Digital HDTV systems
  • Signal demodulation

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