MIPS-I Microprocessor 79RC64 208-BFQFP Exposed Pad
SOT-23
IDT79RC64T575-200DP Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
208-BFQFP Exposed Pad
Operating Temperature
0°C~85°C TC
Packaging
Tray
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
79RC64
Speed
200MHz
Core Processor
MIPS-I
Voltage - I/O
2.5V 3.3V
Number of Cores/Bus Width
1 Core 64-Bit
Graphics Acceleration
No
RAM Controllers
SDRAM
Co-Processors/DSP
System Control; CP0
RoHS Status
Non-RoHS Compliant
IDT79RC64T575-200DP Product Details
IDT79RC64T575-200DP Overview
With a packing size of 208-BFQFP Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 64-Bit cores/bus width. Be aware of the operating temperature around 0°C~85°C TC. A MIPS-I processor is present in this CPU. The CPU contains SDRAM RAM controllers. 2.5V 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with 79RC64.
IDT79RC64T575-200DP Features
MIPS-I Core
IDT79RC64T575-200DP Applications
There are a lot of Renesas Electronics America Inc. IDT79RC64T575-200DP Microprocessor applications.