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IDT79RC64T575-200DP

IDT79RC64T575-200DP

IDT79RC64T575-200DP

Renesas Electronics America Inc.

MIPS-I Microprocessor 79RC64 208-BFQFP Exposed Pad

SOT-23

IDT79RC64T575-200DP Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 208-BFQFP Exposed Pad
Operating Temperature 0°C~85°C TC
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number 79RC64
Speed 200MHz
Core Processor MIPS-I
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 64-Bit
Graphics Acceleration No
RAM Controllers SDRAM
Co-Processors/DSP System Control; CP0
RoHS Status Non-RoHS Compliant
IDT79RC64T575-200DP Product Details

IDT79RC64T575-200DP Overview


With a packing size of 208-BFQFP Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 64-Bit cores/bus width. Be aware of the operating temperature around 0°C~85°C TC. A MIPS-I processor is present in this CPU. The CPU contains SDRAM RAM controllers. 2.5V 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with 79RC64.

IDT79RC64T575-200DP Features


MIPS-I Core


IDT79RC64T575-200DP Applications


There are a lot of Renesas Electronics America Inc.
IDT79RC64T575-200DP Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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