73M1916-IM/F Overview

The 32-VFQFN Exposed Pad package reduces the amount of space on a board.For packing, Tube is used.Mounting type Surface Mount is used.1 circuits are used in this telecom IC .Telecom circuit is possible to increase efficiency by providing 3V~3.6V with a higher voltage.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.With the MicroDAA? series electronic parts, it can provide a lot of similar features.

73M1916-IM/F Features

Available in the 32-VFQFN Exposed Pad package

73M1916-IM/F Applications

There are a lot of Rochester Electronics, LLC 73M1916-IM/F Telecom applications.

• T1/E1/J1 LAN/WAN Routers
• Digital access cross connects
• Multi-Line E1 Interface Cards
• ISDN terminal adapter
• DECT (Digital European Cordless Telephone) Base Stations
• Inverse Multiplexing for ATM (IMA)
• Interfaces to DS3
• T1/E1/J1 add/drop multiplexers (MUX)
• Home Gateway
• Digital subscriber line access multiplexer (DSLAM)