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AD5341BRU-REEL7

AD5341BRU-REEL7

AD5341BRU-REEL7

Rochester Electronics, LLC

DACSurface Mount 4.4mm mm

SOT-23

AD5341BRU-REEL7 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Packaging Tape & Reel (TR)
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
Terminal Finish TIN LEAD
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.65mm
[email protected] Reflow Temperature-Max (s) 30
Pin Count 20
JESD-30 Code R-PDSO-G20
Qualification Status COMMERCIAL
Operating Temperature (Max) 105°C
Operating Temperature (Min) -40°C
Temperature Grade INDUSTRIAL
Number of Bits 12
Converter Type D/A CONVERTER
Settling Time 8 µs
Input Bit Code BINARY
Input Format PARALLEL, WORD
Height Seated (Max) 1.2mm
Length 6.5mm
Width 4.4mm
RoHS Status Non-RoHS Compliant
AD5341BRU-REEL7 Product Details

AD5341BRU-REEL7 Overview


There is a 20-TSSOP (0.173, 4.40mm Width) package that includes this component. Supply voltage is 3V volts. An attachment Surface Mount allows the FPGA module to be attached to the development board. Unlike other FPGA models, this one is contained in Tape & Reel (TR) for the sake of space saving. The total number of terminations is 20. The device has a total of 20 pins on it. It should not be possible to operate the equipment above 105°C degrees Celsius. The operating temperature should be -40°C at least.

AD5341BRU-REEL7 Features


20-TSSOP (0.173, 4.40mm Width) package
20 pin count

AD5341BRU-REEL7 Applications


There are a lot of Rochester Electronics, LLC AD5341BRU-REEL7 Digital to Analog Converters (DAC)?applications.

  • Digital Radio Link
  • Microprocessor Controlled Calibration
  • Calibration
  • Low Cost I/O
  • Automated Test Equipment
  • Automatic Test Equipment
  • Optical Networks
  • Digital Calibration
  • Bus Structured instruments
  • Wireless infrastructure:

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