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AD5381BST-3

AD5381BST-3

AD5381BST-3

Rochester Electronics, LLC

DACSurface Mount 14mm mm

SOT-23

AD5381BST-3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface Mount YES
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Terminal Finish TIN LEAD
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) 30
Pin Count 100
JESD-30 Code S-PQFP-G100
Qualification Status COMMERCIAL
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Temperature Grade INDUSTRIAL
Number of Bits 12
Converter Type D/A CONVERTER
Settling Time 6 µs
Linearity Error-Max (EL) 0.0244%
Input Bit Code BINARY
Input Format PARALLEL, WORD
Analog Output Voltage-Max 3.6V
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $61.96000 $61.96
500 $61.3404 $30670.2
1000 $60.7208 $60720.8
1500 $60.1012 $90151.8
2000 $59.4816 $118963.2
2500 $58.862 $147155
AD5381BST-3 Product Details

AD5381BST-3 Overview


There are two packages that contain it: 100-LQFP package and X package. The supply voltage is 3V volts. With a Surface Mount connector, this FPGA module can be attached to the development board. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are a total of 100 terminations. I am going to present you with a device that is equipped with 100 pins. As a rule of thumb, the operating temperature should not exceed 85°C. There should be no less than a -40°C operating temperature in the machine.

AD5381BST-3 Features


100-LQFP package
100 pin count

AD5381BST-3 Applications


There are a lot of Rochester Electronics, LLC AD5381BST-3 Digital to Analog Converters (DAC)?applications.

  • Low Cost I/O
  • Instrumentation
  • Waveform Reconstruction
  • Wideband communications:
  • Digital Audio Amplifiers
  • Wireless infrastructure:
  • Audio Amplifier
  • Precision AGC Circuits
  • Digitally Controlled Attenuators and Power Supplies
  • LMDS/MMDS, point-to-point

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