In the 20-TSSOP (0.173, 4.40mm Width) package, you will find it. An attachment Surface Mount allows the FPGA module to be attached to the development board. While operating, the operating temperature should be kept within a range of -40°C~125°C. It is designed to maximiTape & Reel (TR)e space efficiency by containing the FPGA model in Tape & Reel (TR). Device package 20-TSSOP is provided by its supplier.
AD5445YRU-REEL7 Features
20-TSSOP (0.173, 4.40mm Width) package
AD5445YRU-REEL7 Applications
There are a lot of Rochester Electronics, LLC AD5445YRU-REEL7 Digital to Analog Converters (DAC)?applications.